EMI4192
PACKAGE DIMENSIONS
WDFN10 2.5x2, 0.5P
CASE 511BM
ISSUE O
2X 0.10 C
PIN 1
REFERENCE
D
A B
E
L1
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
2X
0.10 C
TOP VIEW
EXPOSED Cu
MOLD CMPD
A3
DIM
A
A1
MILLIMETERS
MIN MAX
0.70 0.80
0.00 0.05
0.05 C
0.05 C
NOTE 4
DETAIL B
SIDE VIEW
(A3)
A1
A
C
SEATING
PLANE
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
A3
b
D
E
e
L
L1
0.20 REF
0.15 0.25
2.50 BSC
2.00 BSC
0.50 BSC
0.70 0.90
0.05 0.15
PACKAGE
0.30
OUTLINE
DETAIL A
1
5
8X
L
RECOMMENDED
MOUNTING FOOTPRINT
8X
8X
1.07
0.10
MIN
10
6
2.30
e
9X
b
0.10
M
C A B
1
BOTTOM VIEW
0.05
M
C
NOTE 3
0.45
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent ? Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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EMI4192/D
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